Semiconductor Manufacturing Equipment

Developing Global Niche Top Products for Advanced, Next-Generation Semiconductors

With advances in the miniaturization of semiconductor devices, we have been developing equipment to handle these increasingly small devices. We are also working to develop new technologies enabling us to provide products friendly to the global environment that strike a balance between improved performance and economy. From the front-end process to the back-end process, Shibaura Mechatronics caters to a wide range of customer needs with equipment boasting distinct features.

Front-End Process
Back-End Process
Others
Solution
Process

Front-End Process

Cleaning System / Etching System / Ashing System

Largest Share in Post-CMP Cleaning System in the Silicon wafer Manufacturing Process
Post-CMP Cleaning System
SC300-CC series

This single-wafer cleaning system, applicable to 300 mm wafers, has secured the leading market position in the post-CMP cleaning process for silicon wafer manufacturing, as evidenced by our own research.
Final Cleaning System
SC300-FC series

This single-wafer cleaning system is used to clean 300mm wafers processing step and final cleaning.
Photomask Cleaning System
MC150 series and ARTS™

This single-wafer cleaning system supports products ranging from next-generation EUV photomasks to legacy products.
Photomask Etching System
ARES™ series

Photomask etching system supports products ranging from next-generation EUV photomasks to legacy products.
Largest Share in the Etching Single-Wafer Nitride Films
Hot-H3PO4 Wet Etching System
SC300-HT series

This Hot-H3PO4 wet etching system is evolving as a nitride film etch system for advanced logic devices.
Chemical Dry Etching System
CDE series

This isotropic etching system supports plasma damage-free φ75~300mm wafers.
Low-Temperature Chemical Ashing System
ICE series

This ashing system supports HDIS (High-dose implant strip) and processes 200 mm wafers and 300 mm wafers.
New
FOSB / FOUP Cleaning System
FOC300 series

The unit offers excellent cleaning and drying performance from load to unload with a fully automated system supporting 300mm wafer FOSB or FOUP.

Back-End Process

Bonding Equipment

Largest Share in 2.5D Package Bonders
Multi-Process Bonder
TFC-6500

This flip chip bonder has obtained the largest share in the high-end 2.5D packaging field (based on the survey conducted by Shibaura Mechatronics).
New
High-End Wafer Level Package Bonder
TFC-6600

This bonder achieves face up bonding with higher accuracy and higher UPH than previous FO-WLP packages.
Hybrid Bonder
TFC-6700 / TFC-6800

This ultra-high accuracy bonder is compatible with chip-to-wafer hybrid bonding and fusion processes.
Wafer Level Package Bonder
TFC-9000

This package bonder supports Fan Out Wafer Level Package (FO-WLP) that deliver smaller and thinner packages.
Panel Level Package Bonder
TFC-9300

This high accuracy Fan Out Panel Level Package bonder has obtained the largest share in the FO-PLP field (based on the survey conducted by Shibaura Mechatronics).
Largest Share in COF Bonders for Driver ICs
Reel-to-Reel Bonder
TFC-3600

This high accuracy reel-to-reel bonder has obtained the largest share in the COF field (based on the survey conducted by Shibaura Mechatronics).

Others

Sputtering Equipment for Semiconductors
SWN-5000, BM-1400W

Optimized equipment for back-side electrode coating on power devices or under bump metals, and multi-layer film coating.
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