Reel-to-Reel Bonder
TFC-3600
Supports Processing for Chip On Film (COF)
A high accuracy reel-to-reel bonder suitable for the COF process.
In displays such as TVs, monitors, and mobile devices, it is necessary to bond a driver IC on the film to control the video output signal.
In addition, as the number of output signals increases, high pin counts and fine pitches have become more common, increasing the needs of the high accuracy bonder.
This bonder is dedicated to COF process which enable to achieve a high accuracy bonding with high temperature and pressure.
Shibaura Mechatronics has over 20 years of sales and production experience in the COF bonding field, and our products have been used by many customers for a long time. We are also currently the only equipment manufacturer in the field of reel-to-reel COF.
TFC-3600 supports stable quality of the COF product with "high accuracy bonding capability under the high temperature and high force condition".
We introduce products according to your specific needs!
Features
High Accuracy
Supports stable quality of the COF product with high accuracy bonding capability under the high temperature and high force condition.
With ±1.5µm high accuracy capability, this bonder can achieve stable production with a high yield rate, even for driver ICs with increasingly high pin counts and fine pitches.
High Rigidity Bonding Head
Achieves stable, high force bonding by using a bonding head structure that withstands a maximum bonding force of 490N.
Small Footprint
Using a reel-to-reel film transport mechanism saves space and provides high production capacity.
Product Explanation
| Main Applications | COF package products |
|---|---|
| Accuracy | Face Down ±1.5μm (3σ) *local alignment / R.T conditions |
| Dry UPH | 2,600 or more |
| Bonding Force | Max.490N |
| Tape Width | Max.70mm |
Related Information
Contact Us
- Mechatronics System Division