Post-CMP Cleaning System
SC300-CC series
Largest Share (Based on the Survey Conducted by Shibaura Mechatronics) among the Post-CMP Cleaning Processes
Single-Wafer Cleaning System Applicable to 300mm Wafers
This single-wafer cleaning system applicable for 300 mm wafers hold worldwide No.1 share (based on the survey conducted by Shibaura Mechatronics) in post-CMP processes for silicon wafer manufacturing.
It takes advantage of our extensive experience and technologies in single-wafer cleaning system to deliver high-performance cleaning and necessary and sufficient productivity.
Combined with a polisher, this system minimizes the wafer flow line, contributing to the general productivity of the plant.
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Features
High Performance
Processes fine particles of 19nm or less. Optimization of the transfer efficiency and chamber structure improved the cleaning performance by about 25% in comparison to the conventional system.
Linked with a Polisher
Minimized the wafer flow line by linking with a polisher. This minimization improved productivity and the wet transfer method prevents reverse contamination by foreign materials.
Achievement
Largest Share in the Post-CMP Cleaning System (based on the number of units shipped / based on the research conducted by Shibaura Mechatronics)
Related Information
Contact Us
- Fine Mechatronics Division