An all-in-one system enables all the necessary pre-bond surface treatment processes for Chip to Wafer (C2W) hybrid and fusion bonding.

This product is a pre-bond surface treatment system for hybrid bonding in advanced packaging.
In the field of advanced semiconductor packages for logic semiconductors and memory devices used in high-performance servers, generative AI applications, and high-performance PCs, the need for hybrid bonding is increasing when the microbump size reaches its limitation. The adoption of hybrid bonding is also expanding in image sensor applications.
Surface preparation is a critical processes for hybrid bonding. To enhance bonding performance and ensure bond quality, demand is growing for integrated equipment that combines plasma activation, cleaning, and rinsing processes, as well as for one-stop solutions covering the entire process from surface preparation to bonding.
The HSM-1000 is an integrated system for pre-bond surface treatment, combining our proven vacuum plasma, cleaning, and automation technologies. Furthermore, when integrated with our hybrid bonder, it provides a complete solution for customers' high-volume production requirements.