An all-in-one system enables all the necessary pre-bond surface treatment processes for Chip to Wafer (C2W) hybrid and fusion bonding.

This product is a pre-bond surface treatment system for hybrid bonding in advanced packaging.
In the field of advanced semiconductor packages for logic semiconductors, memory, and image sensors used in high-performance servers and PCs, generative AI, the need for Hybrid bonding is increasing when the microbump size reaches its limitation.
Surface preparation is a critical processes for hybrid bonding. To enhance bonding performance and ensure bond quality, demand is growing for a one-stop surface pre-treatment solution combining plasma activation and cleaning processes.
The HSM-1000 is an integrated system for pre-bond surface treatment, combining our proven vacuum plasma, cleaning, and automation technologies. Furthermore, when integrated with our hybrid bonder, it provides a complete solution for customers' high-volume production requirements.