Low-Temperature Ashing System Applicable to Thin Wafers

This ashing system supports HDIS (High-dose implant strip) and processes 200 mm wafers and 300 mm wafers. Its source / bias discharge system achieves high-speed ashing. In addition, the electrostatic chuck equipped with a cooling mechanism can keep the wafer at a low temperature, allowing it to be used as a popping countermeasure, for ashing of ultra-thin wafers with protective materials, and for ashing and light ashing while suppressing metal oxidation. This system provides a solution to the problems relating to the thin wafer ashing process and, therefore, contributes to the improvement of productivity.