Panel Level Package Bonder
High Performance TFC-9300 / High Accuracy TFC-9310
Supports Processing for Panel Level Package (PLP)
A high accuracy and high productivity bonder suitable for the PLP process.
In mobile devices, such as smartphones, the demand for increased energy efficiency and a smaller footprint is rising, leading to greater expectations for the FO-PLP process, which efficiently produces Fan Out (FO) packages at the panel level, increasing productivity.
In addition to FO (Chip-1st) packages, together with the expansion of 2.5D and 2.XD peackage (Chip-Last) for servers, Thermal Compression (TC) processes are also attracting more attention.
Shibaura Mechatronics has been developing and selling high accuracy PLP bonders since 2014. We have high technical capabilities and a wealth of experience and our bonder has been adopted by major OSATs.
Also TFC-9300 has various functions apply for TC process.
TFC-9300 contributes to customer's production with "high productivity", "high accuracy" and "process compatibility".
We introduce products according to your specific needs!
Features
Supports Large Size Panels (up to 630mm x 650mm)
Capable to handle large size panels up to 630mm x 650mm.
Achieves high accuracy and high productivity at the panel level.
High Productivity
With our proprietary 4 bonding head structures and control technology, the tool can achieve stable and high productivity.
Suitable for Various FO-PLP Processes
We offer optimal solutions for both productivity-oriented Chip-1st and high accuracy request Chip-Last (RDL-1st) processes with our high technology and extensive experience accumulated since the beginning of the PLP market.
Suitable for both face down and face up processes, including several of processes such as DAF and C4.
Product Explanation
| Main Applications | TFC-9300 FO-PLP products TFC-9310 UHD FO-PLP / TC-PLP products |
|---|---|
| Accuracy | Face Down ±3μm (3σ) *local alignment / R.T conditions |
| Dry UPH | 10,000 or more |
| Panel Size | Max.630×650mm Panel |
| Other | Tape feeder |
Related Information
Contact Us
- Mechatronics System Division