Sputtering Equipment for Semiconductors
SWN-5000, BM-1400W
Optimized Equipment for Back-Side Electrode Coating on Power Devices or Under Bump Metals, and Multi-Layer Film Coating
Etching, Cleaning, Chip bonding.
We introduce products according to your specific needs!
We introduce products according to your specific needs!
Features
- Supports thin wafers
- Multi-chamber type
- Wafer temperature control
- Various options (heating, etching, etc.)
- Supports SiC Wafers
- High productivity
Related Information
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The Division in Charge of This Product
- Mechatronics System Division