High-End Wafer Level Package Bonder
TFC-6600
Supports Processing for Ultra High Density Fan Out Wafer Level Package (UHD FO-WLP)
A high accuracy and high productivity bonder suitable for the UHD FO-WLP process.
The application processors used in devices such as smartphones and PCs require high density wiring pitches, which request a higher accuracy.
Additionally, alongside the Si-Interposer, the silicon bridge interconnection in 2.XD packages increase the demands for high accuracy face up bonding.
Shibaura Mechatronics has over 10 years experiences in sales and production in the UHD FO-WLP field, and has a proven track record with major IDMs, foundries and OSATs.
TFC-6600 realizes high quality WLP production with "high accuracy face up bonding" and "high productivity".
We introduce products according to your specific needs!
Features
High Accuracy Face Up Bonding
Achieves face up bonding of ±2μm.
High Productivity
The double-head configuration ensures high accuracy and high productivity.
Possible to combine 2 bonders with one FOUP unit.
Contributes to maximizing production efficiency for customers.
2.XD Product Compatible / Supports Thin Chips
Our own plunge up technology minimizes the damage during pickup of thin chips such as bridges.
Product Explanation
| Main Applications | UHD FO-WLP products |
|---|---|
| Accuracy | Face Down & Face Up ±2μm (3σ) *local alignment / R.T conditions |
| Dry UPH | 5,000 or more |
| Chip Size | Max.□40mm |
| Wafer / Substrate Size | φ200 / 300mm Wafer Max.330×320mm Substrate |
Related Information
Contact Us
- Mechatronics System Division