Multi-Process Bonder
TFC-6500
Supports Multi-Process for Advanced Packages (ADV-PKG)
A high accuracy multi-process bonder suitable for advanced packages.
In the advanced packaging field, which is becoming increasingly important as a core technology supporting the improvement of GPUs used in servers and generative AI, the demands for higher device density and narrower pitch are increasing. And chiplet architecture which combining different kinds of chips into a single package is expected to be a solution.
Shibaura Mechatronics is focused on the advanced packaging field, and has a proven track record with major IDMs, foundries and OSATs.
TFC-6500 can apply to a wide variety of packages, including 2.5D, 2.XD, and 3D packages, as well as the Ultra High Density Fan Out Wafer Level Package (UHD FO-WLP), and supports multiple processes.
As a "flexible multi-process bonder", TFC-6500 contributes to customers from development to production.
We introduce products according to your specific needs!
Features
High Accuracy and High Level Cleanliness
Achieves face down accuracy of ±1μm and face up accuracy of ±3μm.
Achieves high level of cleanliness (Clean Class 100 (industry first)), contributes to high accuracy, high quality production demands.
Supports Multi-Process
Supports both face down and face up bonding processes.
Suitable for advanced packages such as UHD FO-WLP, 2.5D, 2.XD, 3D and TC (Thermal Compression).
Full Inspection Functions
Post-bonding inspection functions contribute to the improvement of the throughput yield.
Product Explanation
| Main Applications | 2.5D, 2.XD, 3D package products, UHD FO-WLP products, Si-Photonics products, etc. |
|---|---|
| Accuracy | Face Down ±1μm (3σ) *local alignment / R.T conditions Face Up ±3μm (3σ) *local alignment / R.T conditions *when option is applied |
| Dry UPH | 2,100 or more |
| Chip Size | Max.□30mm |
| Wafer / Substrate Size | φ200 / 300mm Wafer Max.330×320mm Substrate |
| Other | Supports tape feeder / IR inspection / Various bonding processes |
Related Information
Contact Us
- Mechatronics System Division