Supports Chip-to-Wafer (C2W) Hybrid & Fusion Processing

An ultra-high accuracy bonder apply for C2W hybrid and fusion processes.
In the fields of GPUs, HBM, and image sensors used in servers and generative AI, the need for bumpless bonding is increasing when the microbump size reach to its limitation.
Additionally, the expectation on the chiplet architecture which combining different kinds of chips into a single package also attracts interest in C2W hybrid bonder.
Shibaura Mechatronics started working on the hybrid processes in the early stage and released the bonder to the market since 2016.
We have high technical capabilities and a wealth of experience and our bonder has been adopted by major manufacturing foundries.
TFC-6700 and TFC-6800 contribute to customers from development to production with "ultra-high accuracy", "high level cleanliness", and "extensive experience and track records".