Spin process system for panel
PD-series
Spin process system for panels applicable to high levels of cleanliness, etching, and other wet processes for advanced packages.
The Front-End Process Level of Wafer × Process Technology for Large Square Workpieces
Processing performance at the front-end process level of wafer, targeting large square workpieces, is required in advanced packages.
We introduce products according to your specific needs!
Features
Support for Various Workpieces
Compatible with a wide range of square workpieces used in advanced packages.
- Size: □300 mm to 600 mm and more
- Material: Organic substrates, glass, Si wafers, etc.
Flexibility and Mass Production deployment
Enables flexible unit construction for development and research.
In addition, for mass production deployment, multi-chamber configurations and proposals for future expansion are available.
Compatibility with Various Chemicals
In addition to fine particle cleaning, processes such as etching can be applied.
A wide range of options is also available for physical tools and liquid handling related to these processes.
Related Information
Contact Us
- Fine Mechatronics Division