Front-End Process
-
Post-polishing Cleaning Equipment
SC300-CC seriesLargest share (based on the survey conducted by Shibaura Mechatronics) among the post-polishing cleaning processes
Single-wafer cleaning equipment applicable to 300mm wafers -
Final Cleaning Equipment
SC300-FC seriesCutting-edge single-wafer cleaning equipment applicable to 300mm wafers
-
High-temperature Phosphoric Acid Etching System
SC300-HT seriesLargest share (based on the survey conducted by Shibaura Mechatronics) among the single-wafer nitride film etching processes.
This high-temperature phosphoric acid etching system supports 300mm wafers. -
Photomask Cleaning Equipment
MC150 and ARTSEquipped with a freeze cleaning function
Single-wafer photomask cleaning equipment applicable to 6025 -
Photomask Etching Equipment
ARES seriesPhotomask etching system applicable to EUV masks
-
Chemical Dry Etching Equipment
CDEBringing The Endless Possibilities of CDE to the Unseen Aspects of Processing
-
Low Temperature Chemical Ashing Equipment
ICELow-temperature ashing system applicable to thin wafers
Back-End Process
-
Flip Chip Bonder
TFC-6500Flip chip bonder for high-end 2.5D packages
-
Flip Chip Bonder
TFC-6100Flip chip bonder for cutting-edge packages
-
Flip Chip Bonder
TFC-9300Largest share in the FO-PLP field (based on the survey conducted by Shibaura Mechatronics)
Flip chip bonder for Fan Out Panel Level Packages -
Flip Chip Bonder
TFC-3600Largest share (based on the survey conducted by Shibaura Mechatronics) in the COF field
Flip chip bonder for display drivers