Flip Chip Bonder
TFC-3600
Largest share (based on the survey conducted
by Shibaura Mechatronics) in the COF field
Flip chip bonder for display drivers
Contact Us
This high accuracy reel to reel bonder achieved the largest share (based on the survey conducted by Shibaura Mechatronics) in the COF field.
This flip chip bonder has been favoured by many customers for many years as the long-term popular product.
This bonder realizes customers' wishes by applying the expertise based on our wealth of achievements.
Features
- ・High accuracy
With the high accuracy bonding, this bonder can achieve COF (Chip On Film) packages of stable quality.
This bonder realizes accuracy of ±1.5μm and supports high-accuracy bonding of driver ICs where adoption of a fine pitch is progressing. - ・System dedicated to COF packages
Achieves a high production capacity within a small space by applying a reel to reel film transfer feature.
- ・Stable high-bonding force installation
Achieves stable high-bonding force installation by applying a highly rigid process point structure.
This bonder responds more than sufficiently to the requirement of high-bonding force and thermal eutectic bonding that are necessary for driver IC installation where multi-pin application is progressing.
Reel to reel film transfer featureAchieves high efficiency production in a smaller space
