Contact UsIn the cutting-edge package industry, SiP (System in Package) such as high-density FO-WLP and 2.5D and 3D packages are attracting much attention. This highly flexible high-end flip chip bonder responds to constantly advancing and diverse customer requirements.
Features
- ・High accuracy and a high level of cleanliness
By achieving the accuracy of ±1.0μm and a high level of cleanliness (Cleanliness Class 100), this bonder can achieve stable production.
- ・Supports a variety of package processes
Supports a variety of package processes including flip chip bonding, high-density FO-WLP, 2.5D, 3D bonding, and thermal process.
- ・High yield and stability
Through the high productivity design and process rationalization, this bonder improves the yield.
High level cleanlinessHigh cleanliness class achieved by optimum HEPA filter layout based on the airflow analysis
IR recognition (infrared recognition)Supports high-accuracy production by recognizing the bonded IC and providing the feedback
