Post-polishing Cleaning Equipment
SC300-CC series
Largest share (based on the survey conducted by Shibaura Mechatronics)
among the post-polishing cleaning processes
Single-wafer cleaning equipment applicable to 300mm wafers
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This single-wafer cleaning equipment applicable to 300 mm wafers has the largest share (based on the survey conducted by Shibaura Mechatronics) among the semiconductor wafer post-polishing processes.
This equipment demonstrates a high cleaning performance and adequate necessary productivity that have been achieved through our wealth of experience and technologies relating to single-wafer cleaning equipment.
Combined with a polisher, this equipment minimizes the wafer flow line, contributing to the general productivity of the plant.
Features
- ・High performance
Processes fine particles of 19nm or less. Optimization of the transfer efficiency and chamber structure improved the cleaning performance by about 25% in comparison to the conventional equipment.
- ・Linked with a grinder
Minimized the wafer flow line by linking with a polisher. This minimization improved productivity and the wet transfer method prevents reverse contamination by foreign materials.
- ・Achievement
Largest share among the post-polishing cleaning equipment (based on the number of units shipped/ based on the research conducted by Shibaura Mechatronics)
Double-side horizontally rotating brushMounted with the polished wafer cleaning brush
Unloading portAutomatic transfer by OHT is enabled by a drying out process
