Flip Chip Bonder
TFC-9300
Largest share in the FO-PLP field (based on the survey conducted
by Shibaura Mechatronics)
Flip chip bonder for Fan Out Panel Level Packages
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This high accuracy Fan Out Panel Level Package bonder has the largest share in the FO-PLP field (based on the survey conducted by Shibaura Mechatronics).
This flip chip bonder demonstrates a high operability that has been developed through the wealth of experiences and technologies of our die bonder and flip chip bonder products. With its high maintainability including automatic tool replacement, this bonder supports various customer requirements.
Features
- ・Applicable to large substrate (up to 630mm x 650mm)
Supports large substrates of up to 630mmｘ650mm and achieved high accuracy and high productivity. This bonder is most suitable for FO-PLP mass production that supports large substrates.
- ・Suitable for various FO-PLP processes
With a line-up of optimum options for both the productivity-focused chip-1st process and the high-accuracy RDL-1st bonding process, this bonder offers optimum solutions developed through our advanced technologies and wealth of experiences.
It supports both face-down/face-up bonding processes as well as room temperature bonding and thermal bonding such as DAF. - ・High productivity
Achieves high productivity with 4-sets of bonding head structures.
4-sets bonding head structureMounted the unit structure for the realization of high productivity and high accuracy
Large substrate bonding stageApplicable to large substrates up to 630 mm x 650 mm
