Final Cleaning System
SC300-FC series
Cutting-Edge Single-Wafer Cleaning System Applicable to 300mm Wafers
This single-wafer cleaning system is used to clean 300mm wafers processing step and final cleaning.
It takes advantage of our extensive experience and technologies in single-wafer cleaning system to deliver high-performance cleaning and necessary and sufficient productivity.
Its improved wafer holding mechanism enhances cleanliness at the wafer front and back faces, as well as the edges, contributing to our achievement of the highest quality.
We introduce products according to your specific needs!
Features
High Performance
Supports fine particles of 19nm or less. As a result of review of the transfer efficiency and the chamber structure, cleaning performance was improved by about 25% in comparison to the conventional system.
Improvement of Wafer Holding Mechanism
A new holding mechanism was developed to improve the level of cleanliness of the end sides.
High Productivity
Contributes to the productivity improvement by allowing the selection of up to 8 chamber configurations.
Related Information
Contact Us
- Fine Mechatronics Division