Final Cleaning Equipment
SC300-FC series
Cutting-edge single-wafer cleaning equipment applicable to 300mm wafers
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This single-wafer cleaning equipment cleans 300mm wafers between semiconductor wafer processes and final cleaning.
This equipment demonstrates a high cleaning performance and productivity that have been developed through our wealth of experience and technologies relating to single-wafer cleaning equipment. Its improved wafer maintenance feature and improved cleanliness at the end faces in addition to the wafer front and back faces contribute to our achievements of the highest quality and productivity.
Features
- ・High performance
Supports fine particles of 19nm or less. As a result of review of the transfer efficiency and the chamber structure, cleaning performance was improved by about 25% in comparison to the conventional equipment.
- ・Improved wafer maintenance feature
A new maintenance feature was developed to improve the level of cleanliness of the end faces.
- ・High productivity
Contributes to the productivity improvement by allowing the selection of up to 8 chamber configurations.
Final cleaning processSpinning technology corresponding to the cutting-edge wafer cleaning technology
4 loading portsSupports the 8-chamber production capacity
