Sputtering
Equipment for Millimeter Wave Radar
（BM-700/900）
Sputtering Equipment for Millimeter Wave Radar
・Multi-layered film can be formed (2-7layers).
・Since BM-900 has 3 (max) process chambers, bombard/polymerization treatments are possible.
・Better yield and productivity by line automation
Application example
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Features
- High productivity (30 sec or less per each)
- Space-saving, power-saving
- 2 or more materials mountable in process chamber
- Easy substrate (workpiece) mounting by deposition down
- Short time maintenance (material, shield replacement)
| BM-700 | BM-900 | |
The number of process chambers (max)* |
1 | 3 |
The number of layers (max) |
2 | 6 |
Sputtering material size |
φ150mm | φ150mm |
Plasma process unit |
－ | Option |
Polymerization process unit |
－ | Option |
*Load lock chamber is excluded.
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