COG Bonder
for FPD
COG Bonder
for FPD
COG Bonder (Chip On Glass) is a system that bonds LCD driver IC to the LCD panel with high bonding accuracy.
Our lineup of fully automated high-speed systems covers COG, FOG and FOB bonder.
Features
<Line configuration>
Loader, Cleaner(LCD terminal cleaning unit), COG, FOG, Buffer, AOI, FOB(PWB), Unloader
System name | COG for small size LCD | COG for medium size LCD |
---|---|---|
Model | TTC-3000S | TTC-3000M |
Panel size | 36×60~130×250mm (3-inch~8-inch) |
36×60~290×390mm (3-inch~17-inch) |
IC size | Width: 0.5~2.4mm Length:7~35mm Thickness:0.15~1.0mm |
|
Final bonding accuracy | X Y:±3µm(3σ) | |
Tact time (Depend on process) |
2.8s 1IC 4.5s 2IC |
5.5s 1IC/2 panel handling 10.5s 4IC/1 panel handling |
ACF attachment accuracy | Width:±0.1010mm(3σ) Length:±0.20mm(3σ) |
|
Number of panels handled | 4 panels | 2 panels:130×250~210×270mm 1 panel :210×270~290×390mm |
Dimensions (Include supply and eject space) |
3930(L)×1270(D)×1600(H)mm |
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