Sputtering Equipment for Semiconductors
（SWN-5000）
Sputtering Equipment for Semiconductors
Optimized equipment for back-side electrode coating on power devices or under bump metals, and multi-layer film coating.
Features
- Wafer size: 200,150,100 (mm)
- For thin wafers: about 100 (μm)
- A process chamber : max 5 chambers (max 10 GUN)
- Wafer temperature control by ESC
- Small foot print: W2800×D3600×H2500 (mm)
- Heating and reverse sputtering
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