Sputtering Equipment for Semiconductors

Sputtering Equipment for Semiconductors
(SWN-5000)

Sputtering Equipment for Semiconductors

Optimized equipment for back-side electrode coating on power devices or under bump metals, and multi-layer film coating.

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Features

  • Wafer size: 200 (mm)
  • For thin wafers: about 100 (μm)
  • A process chamber : max 5 chambers
  • Wafer temperature control by ESC
  • Small foot print: W2800×D3600×H2500 (mm)
  • Heating and reverse sputtering

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