Sputtering Equipment for Research and Development

Sputtering Equipment for Research and Development
(CFS-4EP/4ES)

Sputtering Equipment for Research and Development

Load lock type and batch process type sputtering equipment delivering compact size, easy operation, and abundant options.
These two types of sputtering equipment can be used for various applications from R&D to small-lot multi-production.

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Application example

  • Applications
    ・OLED, solar cells, optical parts, biotechnology, semiconductor/ electronic parts, automobile parts/ plastic parts, special film, MEMS
  • Typical film-forming materials
    ・Dielectric film etc.
    SiN, SiO2, ZrO, TiO2, Polymerization film
    ・Transparent conductive film
    ITO, ZnO
    ・Metal film etc.
    Au, Ag, Cu, Si, Ti, Sn, Cr, Al, Ni, DLC, EMC shield

Features

  • Clean side sputtering
  • Load lock type and batch process type
  • Easy operation and maintenance with a touch panel
  • Space-saving, compact equipment
  • Abundant options that meet various customer needs
  • Forms film at both high and low temperatures
  • Sputtering source achieves uniform film thickness distribution over a wide area (±5% (SiO2) in 170mm diameter)
  • Automatic transfer system for small lot production and automatic operation at night
  CFS-4EP-LL<i-miller> CFS-4ES-231
L / L type Batch process type
Sputtering method Side sputtering Side sputtering
Sputtering source 3-inch×3 (4) 3-inch×3
Holder size ø220 ø200
Ultimate pressure 5×10-4 Pa or less 5×10-4 Pa or less
Exhausting time (10min) 7×10-3 Pa or less 7×10-3 Pa or less
Exhausting operation Auto /full automatic Manual
Sputtering operation Manual /full automatic Manual
Power supply RF500W (DC) RF500W (DC)
Temperature Max 300°C (600°C) 300°C
Etching power source Practicable Practicable
Size 1390W×1060D×1650H 950W×860D×1540H

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