Sputtering Equipment for Research and Development
(CFS-4EP/4ES)
Sputtering Equipment for Research and Development
(CFS-4EP/4ES)
Load lock type and batch process type sputtering equipment delivering compact size, easy operation, and abundant options.
These two types of sputtering equipment can be used for various applications from R&D to small-lot multi-production.
Features
CFS-4EP-LL<!-miller> | CFS-4ES-231 | |
---|---|---|
L / L type | Batch process type | |
Sputtering method | Side sputtering | Side sputtering |
Sputtering source | 3-inch×3 (4) | 3-inch×3 |
Holder size | ø220 | ø200 |
Ultimate pressure | 5×10-4 Pa or less | 5×10-4 Pa or less |
Exhausting time (10min) | 7×10-3 Pa or less | 7×10-3 Pa or less |
Exhausting operation | Auto /full automatic | Manual |
Sputtering operation | Manual /full automatic | Manual |
Power supply | RF500W (DC) | RF500W (DC) |
Temperature | Max 300°C (600°C) | 300°C |
Etching power source | Practicable | Practicable |
Size | 1390W×1060D×1650H | 950W×860D×1540H |
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