Slice Etching Equipment
High-Performance, High-Accuracy Slicing Etcher with Proprietary Technology
Largest Share in the Industry (Research by Shibaura Mechatronics)
Compatible up to G10.5
This unit is an etching device that uses hydrogen fluoride (HF) solution in the manufacturing processes for LCD / OLED / μ-LED (backplane).
See here for equipment using related technologies
Features
- Enables superior slice etching process for a range of production processes
- Improves yield through proprietary technologies
- Delivers excellent in-plane etching evenness
- Combination of various cleaning tools enables particle removal with high-level cleaning performance
- Supports docking with various film formation equipment (CVD, ELA)
- Enables saving of etching solution using a concentration management system
- Various options are available
Example Applications
- LCD / OLED / μ-LED TFT Process
Related Information
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The Division in Charge of This Product
- Fine Mechatronics Division