FPD Manufacturing Equipment

Driving the Development of New Types of Next-Generation Displays

In the fields of organic light-emitting diodes (OLEDs) and LCD flat panel displays (FPDs), we maintain our position as a major supplier, and are working to develop high accuracy, high quality, high value added products that support the creation of new displays.

Wet Process

Others

Module Process

Wet Process

High-Level Cleaning Stable Conveyance Supports Docking with Various Sputtering Equipment

Slice Etching Equipment

This unit removes contaminants such as microscopic particles, organic matter, and metal impurities that cause yield loss from the surface of glass panels at various stages of LCD / OLED manufacturing processes.

Developing Equipment

This unit exposes a pattern onto a resist coated onto a glass panel in the resist processing part of the color filter process, and develops it.

Stripping Equipment

This unit peels off various resists in LCD / OLED (front plane, backplane) processes by wet treatment.

Others

Compatible With Various Panel Sizes Ideal for a Wide Range of Chemical Processes Low COO

Panel Spin Cleaning System

Supports Fo-PLP (Panel Level Package) / Fo-WLP (Wafer Level Package) semiconductor back-end processes

Module Process

High Accuracy Bonding High Productivity Rich Lineup

COF Bonder for Flat Panel Display (OLB)

This bonder is used to bond the COF which has the driver ICs on to the FPD panels with high accuracy. It achieves efficient and environmentally friendly production with a high yield rate.

IC / COF Bonder for Flat Panel Display (COG / OLB)

This bonder is used to bond the driver for LCD panels (IC / COF) with high accuracy. Suitable for a wide range of applications and sizes including notebook PCs (NBs), monitors, and in-vehicle displays.

Bonder for Next-Generation Displays

We also offer a lineup of driver bonding equipment for next-generation displays such as micro-OLED (OLEDoS) and micro-LED displays.