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Inquiries About Products and Services
Semiconductor Manufacturing Equipment
Fine Mechatronics Division
Semiconductor Manufacturing Equipment (Front-End Process)
- Post-CMP Cleaning System
- Final Cleaning System
- Photomask Cleaning System
- Photomask Etching System
- Hot-H3PO4 Wet Etching System
- Chemical Dry Etching System
- Low-Temperature Chemical Ashing System
- FOSB / FOUP Cleaning System
Mechatronics System Division
Semiconductor Manufacturing Equipment (Back-End Process / Others)
- Multi-Process Bonder
- High-End Wafer Level Package Bonder
- Hybrid Bonder
- Wafer Level Package Bonder
- Panel Level Package Bonder
- Reel-to-Reel Bonder
- Sputtering Equipment for Semiconductors
FPD Manufacturing Equipment
Fine Mechatronics Division
FPD Manufacturing Equipment (Wet Process / Others)
- Slice Etching Equipment
- Developing Equipment
- Stripping Equipment
- Panel Spin Cleaning System
Mechatronics System Division
FPD Manufacturing Equipment (Module Process)
- COF Bonder for Flat Panel Display (OLB)
- IC / COF Bonder for Flat Panel Display (COG / OLB)
- Bonder for Next-Generation Displays
Vacuum Equipment
Mechatronics System Division
- Sputtering Equipment for Electronic Components
- Multipurpose Sputtering Equipment
- Sputtering Equipment for Research and Development
- Sputtering Equipment for Semiconductors
- Sputtering Equipment for Decorative Coating
- Sputtering Equipment for Optical Components
Other Equipment
Fine Mechatronics Division
- Application of Inkjet Technologies
- Edible Ink
Mechatronics System Division
- Automation System
- Rechargeable Battery Manufacturing Equipment
Inquiries About Shibaura Mechatronics
Corporate Management Division
Investor Relations / Sustainability / Others
Inquiries About Group Companies
For the Group Companies, Please Contact Each Company Directly.