Contact UsHigh accuracy flip chip bonder for cutting-edge packages
This bonder realizes both availability for a variety of processes including COC, COW, TSV, and FC-BGA and high productivity with the 2-sets bonding head structure.
This bonder is applied in production sites of many customers as the solution for the fast growing demand for cutting-edge semiconductor packages.
Features
- ・Supports a variety of package processes
Supports a variety of processes including ultrasonic wave, ACP/NCP, solder reflow, and thermocompression bonding.
- ・Abundant optional functions
Equipped with a variety of functions including flux transfer, pulse heat, and ultrasonic head.
- ・Shorter cycle time
Achieves high productivity through the 2-sets bonding head structure.
2-sets bonding head structureSupports the productivity improvement by using the 2-sets bonding head unit
