High-Speed,Multi-Layer,Single-Wafer Sputtering Equipment

High-Speed,Multi-Layer,Single-Wafer Sputtering Equipment
(BM-1000/1400)

High-Speed,Multi-Layer,Single-Wafer Sputtering Equipment

Realizes low running costs and high productivity and saves space.

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Application example

  • Automobile mirrors (photocatalyst)
  • Electronic parts
  • Decorative coating films
  • Optical films (AR coat, Enhanced reflection coating, ITO coating)

Features

  • Single-wafer load lock sputtering equipment
  • Supports wafers up to a maximum of eight inches
  • Extendable to a maximum of seven processing chambers
    (BM-1000:5chambers, BM-1400:7chambers)
  • Inverse sputtering with our original cup gun method secures less damage
  • Capable of mounting heating unit

PAGETOP