Designed for glass substrates, wafers, OLED panels, LCD panels, optical pick-up lens, LPF for digital cameras, etc.
Bubble-free bonding of glass substrates by uniform spin coating of adhesives and bonding in vacuum chamber
- Bubble-free vacuum bonding
- With UV curing
- Supports various substrate shapes and films
- Conditions of Spin, UV curing and bonding can be set to assure uniform film thickness after bonding
| Substrate to be handled |
Thickness | 0.05mm to 2.0mm |
|---|---|---|
| Size | Circular: Φ28mm to Φ200mm Rectangular: □22mm to □140mm |
|
| Ultimate Pressure | 5Pa | |
| Equipment Dimensions | 1400W×1000D×1800H | |
