Flip Chip Bonder>>TFC-3600-300

Flip Chip Bonder
>>TFC-3600-300
(for LCD Driver)

Flip Chip Bonder>>TFC-3600-300(for LCD Driver)

300mm wafer applicable, high accuracy flip chip bonder for COF

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Features

  • Accuracy
    ±1.5μm(3σ)
  • Machine cycle time
    1.15s/die(in a board precedence recognition mode)
  • Bond force setting
    10N~350N
  • Can handle 25μm thickness film
  • Extensive experience and excellent results in bonding technology for LCD driver packages

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