Flip Chip Bonder>>TFC-900A

Flip Chip Bonder
>>TFC-900A

Flip Chip Bonder>>TFC-900A

300mm wafer applicable
Ultrasonic flip chip bonder for camera modules

Contact Us

Features

  • Accuracy
    ±7μm(3σ)
  • Machine cycle time
    1.4s/die
  • Bond force setting
    1N~50N
  • Substantial particle measures for camera modules
  • Available for a logic products and conventional products
  • The installations for a smart phone camera use

PAGETOP