Flip Chip Bonder>>TFC-6100/6110

Flip Chip Bonder
>>TFC-6100/6110

Flip Chip Bonder>>TFC-6100/6110

High Accuracy Flip Chip Bonder for 2.5D/3D Package
Equipment optimized for mass production of 2.5D/3D Package (COC, COW, TSV, FC-BGA, etc.)

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Features

  • Accuracy
    TFC-6100:±1.5μm(3σ), TFC-6110:±3μm(3σ)
  • Machine cycle time
    TFC-6100:0.9 sec/die, TFC-6110:0.7sec/die
  • Bonding Force
    0.5N-300N (Replaceable heads, low-force, high-force)
  • Suitable for large size substrates
    300mm or 320 x 330mm (width × length) substrates are selectable
  • Various Options
    Flux dipping, pulse heat, ultrasonic bonding head, face up bonding
  • Various processes
    Ultrasonic, ACP/NCF, solder reflow, thermo compression

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