Flip Chip Bonder>>TFC-6000

Flip Chip Bonder
>>TFC-6000

Flip Chip Bonder>>TFC-6000

High accuracy flip chip bonder for advanced package
Best solution for COC, COW, TSV, FC-BGA, etc.

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Features

  • Accuracy
    ±1.5μm(3σ)
  • Machine cycle time
    1.8s/die
  • Bond force setting
    0.5N~490N (Replaceable heads, low-force, high-force)
  • Suitable for large size substrates
    300mm or 320 x 330mm (width × length) substrates are selectable
  • Various options
    Flux dipping, dispensing, pulse heat, ultrasonic bonding head, face up bonding
  • Various processes
    Ultrasonic, ACP/NCP, Solder reflow, Thermo compression

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