Die Bonder>>FTD-8000-MB

Die Bonder
>>FTD-8000-MB

Die Bonder>>FTD-8000-MB

High accuracy die bonder most suitable for 3D package of thinner die
Best solution for 3D package such as NAND flash memory or DRAM

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Features

  • Accuracy:±10μm(3σ)
  • Numbers of installation thin die bonding [mass production of the thinner die (25μm or less)]
  • Parallel motion by adopting intermediate stage
    [About 50% UPH improvement in comparison with a direct bonding head type (compared to our product)]
  • Bond force Max 50N (option:Available for 70N)

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