An essential requirement in macro examination of the two faces of wafers is the ability to discard data that is difficult to quantify and to deliver visual data that fully records and highlights the results of sensory testing. These results are a key to detecting defects that can lower yields and for complementing sensory tests during manufacturing of devices.
A further refinement, one indispensable for reducing TCO (Total Cost of Ownership), is the functional ability to detect potential defects hidden in noise. AI-12 delivers a solution offering pre-eminent performance in defect detection and in identifying potential defect, allowing for their early eradication.

- Applications
Inspection of wafer surface and reverse side
Automatic/manual inspection
Comparative inspection before and after cleaning
- Functional overview
Defect classification
Locating defect coordinates
- Applicable to
AI-12: Si bare or patterned wafer (Φ300mm)
AI-8: Si bare or patterned wafer (Φ200mm)
- Basic performance
Pixel resolution: 0.3μm/pixels
Inspection method: Automatic Inspection system by Image Intensifier
Inspection areas: Surface, reverse side
Data Sampling: High resolution image
Throughput (reference value): AI-12: 25sheets/25minutes (surface automatic inspection)
- Standard features
POD Opener: x 1
FOUP Stage: x 1
Wafer reversal function
GEM/SECS communication
Visual inspection stage
- Option
Rough inspection & classification
Wafer ID reader
FOUP/FOSB ID reader
FOSB stage
Other product: AI-12PL (300mm) for dual FOUP type, AI-8 (200mm) for WT type