Flip chip bonder for 300mm wafer, suitable for high-speed bonding of small chips
- High productivity
Mounting tact time: 1.0 sec/point (precision of ±15µm) or 1.2 sec/point (precision of ±10µm) - High reliability
Fine bonding load control: 1 to 20N - Supports various processes
Options provide support for various processes
Soldering process, NCP, ultrasonic process, etc. - Various options, applicable to multi-chip mounting automatic tray feeding and flux transfer dipping
