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| Equipment name | Type | Your contact |
|---|---|---|
| Wet Cleaning Equipment | Fine Mechatronics Division | |
| Developing Equipment | ||
| Stripping Equipment | ||
| Etching Equipment | ||
| Spin Cleaning Equipment for Low-Temperature Polysilicon LCDs | ||
| PI Inkjet Coater | ||
| Seal Dispenser | ||
| LC Drop Fill Equipment | ||
| Cell Assembly Equipment | ||
| UV Curing Equipment | ||
| Outer Lead Bonders | TTO Series | Bonding Division |
| Equipment name | Type | Your contact |
|---|---|---|
| Ion Chemical Etching Equipment | ICE200/ICE300 | Semiconductor Manufacturing Division |
| Remote Plasma Ashing Equipment | RPA300 | |
| Chemical Dry Etching Equipment | CDE-80N | |
| Resist Ashing Equipment | µASH 8100W | |
| Single Wafer Wet Cleaning Equipment | SC Series/SC300i | |
| Single Wafer Photo-mask Wet Cleaning Equipment | MC225 | |
| Automatic Wafer Edge Inspection Equipment | EI-12 | |
| Automatic Wafer Surface Inspection Equipment | AI-12 | |
| Die Bonders | FTD-1780/FED-1780 FTD-1900/FED-1900 FED-1711S |
Bonding Division |
| Flip Chip Bonders | TFC-900 TFC-1000M/1000M-300 TFC-2100 TFC-2100C ACF SYSTEM |
|
| Inner Lead Bonders | TTI-810 |
| Equipment name | Type | Your contact |
|---|---|---|
| Single Layer Sputtering Equipment | Stella Series | Vacuum & Laser Systems Division |
| Multi-layer Sputtering Equipment | OCTAVA Series | |
| Vacuum Bonding Equipment | Cielo Series | |
| Sputtering Equipment for Master Disc Process | CDS-6PH |
| Equipment name | Type | Your contact |
|---|---|---|
| Sputtering Equipment for Research and Development | CFS-4ES/i-Miller | Vacuum & Laser Systems Division |
| Double-Sided Sputtering Equipment | SYSTEM Series | |
| Batch Type Sputtering Equipment | CFS-12P-100H | |
| Large Batch Type Vacuum Evaporation Equipment | CU-36PV | |
| High-Speed, Single-Wafer Sputtering Equipment | M-600 | |
| Single-Wafer, Multi-Layer Sputtering Equipment | BM-1000 | |
| Photo Catalysts (Hydrophilic Mirror) Sputtering Equipment | BM-1400PC | |
| Plasticization Coating Equipment | PLACOAT/CFS-36PV-100 | |
| Low Temperature Multi-Layer Sputtering Equipment | CCS-1401/1601 | |
| Vacuum Coating Equipment for Semiconductors and Electronic Components | BHCU-12P-7511 | |
| Vacuum bonding equipment | ||
| OLED vacuum bonding equipment |
| Equipment name | Type | Your contact |
|---|---|---|
| Spot Welding YAG Laser Equipment | Vacuum & Laser Systems Division | |
| YAG Laser Equipment | ||
| YAG Laser Welder | ||
| High Power LD Pumped YAG Laser Equipment | LAL-200 Series | |
| YAG Laser Marker | LAYMARK LAYMARK2 |
|
| Wafer Marker | ||
| Laser Marker for Wafer Level CSP | ||
| Laser Marker for TAB-IC | ||
| Pattern Cutting Equipment for FPD | ||
| Laser Cutting Equipment |
| Equipment name | Type | Your contact |
|---|---|---|
| Microwave Heating Equipment | Vacuum & Laser Systems Division | |
| Microwave Plasma Processing Equipment |
