Submission to SEMICON Japan 2007, December 5 to December 7, 2007

From the wafer process through to the assembly process, Shibaura Mechatronics delivers high productivity, state-of-art process equipment that takes miniaturization to the 30nm generation and beyond, and supports advances in materials.

1. Sessions: Wednesday December 5 to Friday December 7; 10:00 – 17:00
2. Venue: Makuhari Messe
    Front-End Process: Hall 6 D-1101
    Back-End process: Hall11 C-903

3. Exhibition Details

(1) Front-End Process
Products on display
-Chemical dry etcher for fine processing technology (CDE300)
-High productivity ashing system (µASH340)
-Oxide etcher (ICE305)
-Single-wafer wet processor for nano-patterning (SC300i)
-Single-wafer wet processor, high productivity type New! (SC300GXⅡ)
-Automatic wafer bevel and near edge inspection tool Actual equipment on display (EI-12)
-Wafer Cassette Inspection tool Actual equipment on display (CS-12)
-Vacuum bonder (wafers, glass and optical discs)
-Back electrode sputtering equipment New!
-Maintenance service for all kinds of equipment; used equipment business

(2) Back-End process
Products on display
-High accuracy die bonder for LSI-PKG Actual equipment on display New! (FTD-7000P)
-Ultra high speed flip chip bonder For small devices Actual equipment on display New! (TFC-5500C)
-High accuracy flip chip bonder for FPD driver packaging New! (TFC-3200)
-High accuracy flip chip bonder for variety of packaging (TFC-900/1000/2100C)
-Laser marker for semiconductor (Wafer Level CSP marker, TCP/COF marker)
-Maintenance and service network for all kinds of equipment

For more details of the exhibits, please visit: http://www.semiconjapan.org/SCJAPAN2007-EN/index.htm

Please note, we expect the reception area to be very crowded on the opening day of the exhibition, and we strongly recommend advance on-line registration on the above site.