Submission to SEMICON Japan 2006, December 6 to December 8, 2006

Shibaura Mechatronics Corporation will introduce equipment and designs featuring state of the art process technology from the wafer process through to the assembly process.

1. Sessions: Wednesday December 6 to Friday December 8 10:00-17:00.
2. Venue: Makuhari Messe, Hall 6 (6D-1101)

3. Exhibition Contents

(1)Scope of Display
The display will cover dry process equipment, wet process equipment and wafer inspection equipment that directs the most advanced technologies available to the 45nm process and high productivity; the diatouch system essential for high level, high capacity semiconductor packages; and new process technology. We will also introduce the WL-CSP laser marker, vacuum bonding equipment and sputtering equipment.

(2)Products on display
  Wafer process equipment
      -Dry etching/ashing equipment
      -Single wafer wet processor
      -Wafer vacuum bonding equipment
      -Sputtering equipment

  Inspection Equipment
      -Wafer inspection equipment

  Assembly equipment
      -Multiple CSP high-precision die bonder
      -Small chip high-speed flip chip bonder
      -YAG laser markers

(3)Actual equipment on display
      -Wafer inspection equipment
      -Cassette shape checking equipment
      -TFC-900 US (high-speed flip chip bonder)
      -FTD-7000 (high-precision die bonder) [Reference exhibition]

For more details of the exhibits, please visit: http://wps2a.semi.org/wps/portal/_pagr/127/_pa.127/418?languageId=ja&toggleLanguage=en