Shibaura Mechatronics at SEMICON Japan 2005, December 7 to December 9, 2005

At SEMICON Japan 2005, Shibaura Mechatronics Corporation will introduce equipment offering functions and features that bring the latest technologies to the semiconductor manufacturing process, from wafer processing to assembly.

1. Session: Wednesday, Dec. 7 to Friday, Dec. 9, 10:00 to 17:00¡¡
2. Venue: Makuhari Messe, Hall 6 (6B-1101)
3. Contents of the exhibit

(1) Scope of the exhibit
Introduction of 45nm process supporting etching and ashing equipment, single wafer cleaning equipment, wet & dry process composite equipment, automatic wafer surface and edge inspection equipment, sputtering equipment, vacuum bonding equipment, flip chip bonder, the die bonder most suited for supersonic low-pitch sound bonding process and CSP, and laser marking equipment.

(2) Equipment to be introduced
Wafer processing equipment
  -Eching and ashing equipment
  -Single wafer cleaning equipment
  -Dry & wet process composite equipment
  -Sputtering equipment
  -Vacuum bonding equipment
Inspection equipment
  -Automatic wafer edge face inspection equipment
Assembly equipment
  -Laser marking equipment
  -High accuracy flip chip bonder
  -Joined system pressure bonding equipment
  -High speed flip chip bonder

(3) Equipment on display
  -Automatic wafer edge face inspection equipment
  -Laser marking equipment
  -TFC-2100C US: High accuracy flip chip bonder
  -TFC-FB1 Combined system pressure bonding equipment)
  -TFC-900 US: High speed flip chip bonder

For more details of SEMICON Japan 2005, visit
http://wps2a.semi.org/wps/portal/_pagr/127/_pa.127/418?languageId=ja&toggleLanguage=en