Shibaura Mechatronics at "SEAJ Forum 2005"

Shibaura Mechatronics Corporation participated in the SEAJ Forum 2005 as a session panelist and exhibitor. We send our thanks and appreciation to everybody who visited our booth and attended the panel discussions.

1. Date and time: Monday, Sept. 26 - Tuesday, Sept. 27, 2005, 9:30 - 17:00
2. Venue: 3F Convention Center, Pacifico Yokohama, Yokohama, Japan

3. Theme of Forum:
 "The business model of the Asian semiconductor industry and manufacturing equipment technologies"
 "Forecasting prospects for Japanese LCD panel manufacturing equipment"

4. Participation in special sessions
 (1) Session on "Assembly and packaging technologies for high-power white LED light sources."
 Panelist: "Achieving high speed, low temperature bonding."
 Kaneto Matsushita, Chief Specialist, Bonding Equipment Division, Shibaura Mechatronics Corporation
5. Panels exhibited
 (1) Delivering the latest and optimized performance, from the front-end to back-end process Shibaura Mechatronics Corporation LCD Manufacturing Equipment
 (2) ICE300/RPA300 Ion chemical etching system and remote plasma ashing system
 (3) SC300 i series single wafer wet processor
 (4) Ultrasonic bonding flip chip bonder line up
 (5) Transport substrates in a position close to the vertical.
 VIP (Vertical Integrated Processor) Vertical Type Wet Processor

6. SEAJ Forum 2005 web site:http://www.seaj.or.jp/event/eve4_f.htm